Raspberry Pi has announced the general availability of the RP2350 A and B, the SoC that powers the Raspberry Pi Pico 2 which ...

The BG29 is available in compact quad flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial ...

Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the ...

In this case an FTDI chip had been designed with a PCB footprint for a QFN package when the only chip to be found was a QFP from a breakout board. The three boards which make up the adapter For ...

The company's ultra-small BG29 with expanded memory and ultra-low power is ideal for connected health devices and tiny ...

Silicon Labs unveils the ultra-low-power BG29 Bluetooth wireless SoCs with expanded memory at Embedded World 2025.

It was special because the original NES custom DIP chips had been sanded down to something like a surface-mount QFN package. Back when our colleague [Arya] wrote up the project there wasn’t much ...

Ultra-small BG29 with expanded memory and ultra-low power is ideal for Connected Health devices AUSTIN, Texas, /PRNewswire/ ...

VSOP383xx series of preamplifier circuits for IR remote control applications in consumer products with the new Cyllene 2 IC. Offered in the 2mm x 2mm x 0.76mm QFN package, the improved solutions ...

The BG29 is available in compact quad flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial memory with significant RAM and Flash capacities. These extended memory ...

These upgraded components come in a compact 2 mm by 2 mm by 0.76 mm QFN package and serve as drop-in replacements for existing devices, offering a wider voltage supply range of 2.0 V to 5.5 V and ...