Hanebeck said 2.3 times more GaN chips can fit on a 300mm wafer than on a 200mm wafer, bringing down the cost of production. (Reporting by Hakan Ersen, Writing by Louis van Boxel-Woolf, Editing by ...

Infineon Technologies is positioning itself at the forefront of a shift in server power architecture, driven by the rapid adoption of high-voltage direct current (HVDC) designs. As AI accelerates ...