uses a 'unique three-piece PCB' design. At its CES 2025 presentation, the company only demonstrated the 'high-density' PCB carrying the massive 92 billion-transistor GB202 graphics processing unit ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

The PCB Designer will be responsible for creating and optimizing PCB layouts, ensuring high-quality design for ...

uses a 'unique three-piece PCB' design. At its CES 2025 presentation, the company only demonstrated the 'high-density' PCB carrying the massive 92 billion-transistor GB202 graphics processing unit ...