完成前端设计后，紧接着就是后端设计。后端设计基于之前前端设计生成的门级网表，在给定大小的硅片面积内，对电路进行布图规划（FloorPlanning）和布局布线（Placement and Routing，P&R），再对布线的物理版图进行功能、时序以及物理规则上的各种验证。后端设计 ...

In the physical design realm, one of the major shifts we see is a growing need for the use of a hierarchical floorplan methodology. While hierarchical floorplanning has been around for years, the ...

James Vincent is a senior reporter who has covered AI, robotics, and more for eight years at The Verge. Google is using machine learning to help design its next generation of machine learning chips.

Capturing the designer¡¦s intent during floorplanning plays a critical role to improve design productivity of systems-on-chip (SoC). This paper presents a design technique which helps manage changes ...

Take a system-level approach to planning, analyzing, and implementing a PDN layout to meet a target impedance. Greater system complexity and ever-higher clock speeds continue to push IC power ...

As the number of transistors doubles almost every two years, the ability to use a flat approach for full chip floorplanning and perform flat P&R is hindered by the capacity limitation of current EDA ...

One of the SoC design flow steps that’s carried out manually using EDA tools is floorplanning. AI/ML can be trained to perform the same task to achieve faster time-to-market. Pain points of the ...

This white paper focuses chip floorplanning and the key step of macro placement, which is crucial for satisfying PPAC requirements: Similar to building a house or a skyscraper, a floorplan is a ...

All-in-one design integrates microfluidic cooling into electronic chips Viable floorplanning solutions must leave empty regions on the chip to achieve all of the subsequent steps — placement of ...