The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

Both capacitively (RIE) and inductively (ICP) coupled plasma etcher with fluorine-based gases (CF4, CHF3, C4F8, SF6), BCl3, nitrogen, argon, and oxygen for anisotropic dry etching of Si-based ...

In a conventional plasma etching chamber, the incident ions bombard the ... rough and irregular surfaces in practice. Nevertheless, dry adhesives have numerous applications in nanoelectronics ...

A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch. Using a wafer-level RF source, gas penetrates the top of ...