近来，随着半导体集成度的提高，晶圆厚度变得越来越薄，这当然给“切单”工艺也带来了不少难度。 一、晶圆切割（Wafer Dicing）的发展历程 图1. 晶圆切割方法的发展历程（切单） 前道和后道工序通过各种不同方式的互动而进一步发展：后道工序的进化可以 ...

Top Regions Data Covered in this Report. (North America, Europe, Asia Pacific, Middle East & Africa, and Latin America) This report gives a detailed description of all the factors influencing the ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

The Fullstar Vegetable Chopper has two blades for dicing: a small dice and a large dice blade. The strong metal blades can slice through hard and soft vegetables, including potatoes, celery ...

01, 2024 (GLOBE NEWSWIRE) -- Transparency Market Research Inc. - The global dicing tape market is estimated to flourish at a CAGR of 6.5% from 2022 to 2026. Transparency Market Research projects ...

The global dicing tapes market revenue was around US$ 1,311.9 million in 2021 and is estimated to reach US$ 2,366.5 million by 2031, growing at a compound annual ...

Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...

Comes with a bewildering variety of accessories. Fun as that sounds, the mechanics of creating a dicing machine are quite demanding. Food processors with slicing-disc attachments are great at ...

If you want a food processor that can do it all, from slicing and chopping to fine dicing and pureeing, the Breville Paradice 16 is worth the expense. This heavy-duty appliance can handle any task ...