By 2016, most people have got the hang of doing SMD soldering in the garage–at least for standard packaging. Ball Grid Array or BGA, however, remains one of the more difficult packages to wor… ...

From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.

Matching the recommended soldering profile of the BGA. The issue can be made worse if the BGA manufacture’s recommended soldering profile is not followed, resulting in cold solder joints. There should ...

The advanced machinery includes an automated solder paste dispensing printer, high-speed pick-and-place to ensure the placement of any size solder ball as small as .020” (.50 mil), a 10-zone ...

1) BGA sockets can't be re-soldered by hand. They're very fine and go underneath the chip in a way that's inaccessible. They're typically applied by oven and people who try to reflow the solder at ...

Claiming to be ideal for BGA rework and repair, these electrically-conductive, solder-free adhesives are supplied as a dry film on a Mylar carrier and are Z-axis conductive. The ...

Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the company.