NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...

such as 3D NAND and finFETs For these devices, chipmakers face a multitude of challenges in the fab. But one surprising and oft-forgotten technology is emerging as perhaps the biggest challenge in ...

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the ...

NAND Flash is a type of non-volatile memory technology that has revolutionized data storage in the digital age. It is a form of flash memory, which means it can be electrically erased and reprogrammed ...

The ALD Tungsten process is helping 3D NAND manufacturers overcome the technical challenges of producing memory chips with higher storage capacity. 3D NAND is a type of non-volatile memory, which ...

T1C and 3T0C designs combine performance of DRAM with manufacturability of NAND, enabling cost-effective, high-yield ...

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...

Workarounds include stacking more layers on top of each other (3D NAND) and increasing the number of voltage levels – and thus bits – within an individual cell. Although this has boosted the ...

The drive uses the latest PCIe Gen5 x4 controller and 3D TLC NAND, offering read and write speeds of up to 14,800MB/s and ...